Oracle Server X6-2M
 
Netra Modular System
 

PLA-Support>Sun Systems>Sun_Other>Sun Collections>SN-OTH: x64-CAP VCAP
 

In this Document

Goal

Solution

References

Oracle Confidential PARTNER - Available to partners (SUN).
Reason: FRU CAP

Applies to:

Goal

 How to Remove and Replace an Oracle Server X6-2M CPU in the Netra Modular System (NMS)

Solution

CAP PROBLEM OVERVIEW: X6-2M CPU REPLACEMENT

DISPATCH INSTRUCTIONS

WHAT SKILLS DOES THE ENGINEER NEED:

Netra Modular System Training

TIME ESTIMATE: 60 minutes

TASK COMPLEXITY: 3-FRU

FIELD ENGINEER INSTRUCTIONS

WHAT STATE SHOULD THE SYSTEM BE IN TO BE READY TO PERFORM THE RESOLUTION ACTIVITY? :

Oracle Server X6-2M Differences

The Oracle Server X6-2M is a customized modular version of the Oracle Server X6-2.
These are the Oracle Server X6-2M differences for the Netra Modular System:

- Thumb-pull levers for removing a node from the system replace the green hot-swap levers.
- After you push the Power button, the green Power/OK LED begins flashing to indicate hot-swap is initiated. See Oracle Server X6-2M LEDs.
- FBA provides plug-and-play capability, eliminating the cabling process. This feature is the most significant physical difference between the servers.
- Serial console is not available because the serial port is used by the modular system to detect the node's presence. Access to the SP is through the network (NET_MGT) port through a switch in the FMM.
- The node power supply is not a CRU-serviceable item.
- The BIOS is customized.
- Some Oracle ILOM functions are either not available or have restrictions.
- A factory configuration containing an Oracle Quad 10Gb Ethernet Adapter is available.
- The DVD drive is not available.

Note - Because the nodes are identical in their serviceable components (DIMMs, hard drives, batteries, and fans) to the Oracle Server X6-2, the procedures for servicing these Oracle Server X6-2M components are mostly the same. The key difference is that some FRUs can be accessed only by removing the FBA. In the Oracle Server X6-2 Service Manual a distinction is made about CRUs that can be serviced without turning off power. This distinction does not apply to nodes used in the modular system. Any service on a node requires that the node be completely powered off and removed from the system to a clean, antistatic workbench.

The Oracle ILOM on a node in the modular system supports all the standard Oracle ILOM interfaces that are described in the Oracle ILOM documentation.

If the system is still up and functioning, the customer should perform an orderly and graceful shutdown of applications and OS. Then power off the server and remove the node from the system.
A data backup is not a prerequisite but is a wise precaution.

WHAT ACTION DOES THE ENGINEER NEED TO TAKE:

Note - If you pull a node out a few inches, you must wait at least 5 seconds before reinserting the node. Failing to wait might cause the node not to power on.

1. Prepare the server for service.

a. Stop all applications that are running or scheduled to run within the service period.
b. If the node is not responding, remove it from the modular system without powering it down.
c. If the node is responding, gracefully power down the node by pressing and quickly releasing the Power button on the front panel.
d. The green OK LED begins to flash, indicating that the node power-down sequence has completed.
e. When the node has powered off, removed it from the system to a clean, antistatic workbench.
f. Attach an anti-static wrist strap.
g. Remove the top cover

2. If the server has a DVD drive, disconnect the DVD cable from the disk backplane, carefully pull it through the chassis mid-wall, and move it to the side away from the air baffle.

3. If the server has an Oracle PCIe NVMe switch card installed, disconnect the switch card cables from the disk backplane, carefully pull them through the chassis mid-wall, and move them to side away from the air baffle.

4. Lift the air baffle up and out of the server and put it aside.

5. Identify the location of the failed processor by pressing the Fault Remind button on the motherboard.(LED is off: CPU is operating properly, LED is on (amber): CPU is faulty and should be replaced.)

6. Gently press down on the top of the heat sink to counteract the pressure of the captive spring-loaded screws that secure the heat sink to the motherboard. Loosen the four Phillips captive screws in the heat sink for the faulty CPU. Using a No. 2 Phillips screwdriver turn the screws counter clockwise alternately one and one half turns until they are fully removed.

7. To separate the heat sink from the top of the CPU, gently wiggle the heat sink left and right, while pulling upward. A thin layer of thermal compound separates the heat sink and the CPU. This compound also acts as an adhesive. Note –Do not allow the thermal compound to contaminate the work space or other components.

8. Use an alcohol pad to clean the thermal grease from the underside of the heatsink. Be very careful not to get the thermal grease on your fingers.

9. Disengage the processor release lever on the right side of the processor socket (viewing the server from the front) by pushing down on the lever and moving it to the side away from the processor, and then rotating the lever upward.

10. Disengage the processor release lever on the left side of the processor socket (viewing the server from the front) by pushing down on the lever and moving it to the side away from the processor, and then rotating the lever upward.

11. To lift the ILM assembly load plate off of the processor socket, rotate the processor release lever on the right side of the processor toward the closed position (the ILM assembly load plate is lifted up as the release lever is lowered toward the closed position) and carefully swing the ILM load plate to the fully open position.

12. To remove the processor from the processor socket, acquire the processor removal and replacement tool and perform the following steps (Caution - Before removing the processor, ensure that you are using the correct color-coded processor removal and replacement tool):

a, Locate the button in the center of the top of the processor removal and replacement tool and press it to the down position.
b. Properly position the tool over the processor socket and lower it into place over the processor socket. To properly position the tool over the processor socket, rotate the tool until the green triangle on the side of the tool is facing the front of the server and it is over the left side of the processor socket when viewing the server from the front.
c. Press the release lever on the tool to release the center button and engage the processor. An audible click indicates that the processor is engaged.
d. Grasp the tool by the sides and remove it from the server.
e. Turn the tool upside down and verify that it contains the processor.
f. While holding the processor tool up side down, press the center button on the tool to release the processor.
g. Carefully grasp the processor by the front and back edges, lift it out of the tool and place it with the circuit side down (the installed orientation) into an antistatic container.
h. Carefully clean the thermal grease off the top of the processor.

Installing the CPU.

1. Unpack the replacement processor and place it on an antistatic mat.

2. Ensure that the replacement processor is identical to the failed processor that was removed.

3. Ensure that the two processor ILM assembly levers and the ILM assembly load plate are in the fully open position.

4. To install the replacement processor into the processor removal and replacement tool, acquire the tool and perform the following steps:

a. Press the button in the center of the tool to the down position.
b. Turn the tool upside down, grasp the processor by its front an back edges and position the processor (circuit side up) in the tool so that the triangle on the corner of the processor aligns with the triangle on the side of the processor removal and replacement tool.
c. Lower the processor into the tool and press the tool release lever to release the center button and engage the processor. An audible click indicates that the processor is locked in place.
d. Properly position the tool over the processor socket and lower it into place. To properly position the tool in the processor socket, rotate the tool until the green triangle on the side of the tool is facing the front of the server and it is over the left side of the processor socket (when viewing the server from the front) and lower the tool into the processor socket.
e. Press the center button in the tool down to release the processor so that it is placed in the socket.
f. Remove the processor removal and replacement tool.

5. Visually check the alignment of the processor in the socket. When properly aligned, the processor sits flat in the processor socket. Caution - Do not press down on the processor. Irreparable damage to the processor or motherboard might occur from excessive downward pressure. Do not forcibly seat the processor into the socket. Excessive downward pressure might damage the socket pins.

6. Swing the processor ILM assembly load plate into the closed position. Ensure that the load plate sits flat around the periphery of the processor.

7. Engage the socket release lever on the left side of the socket (viewing the server from the front) by rotating it downward and slipping it under the catch.

8. Engage the socket release lever on the right side of the socket (viewing the server from the front) by rotating it downward and slipping it under the catch.

9. Use the syringe (supplied with the new or replacement processor) to apply approximately 0.1 ml of thermal grease to the center of the top of the processor. To measure 0.1 ml of thermal grease, use the graduated scale on the thermal grease syringe. Note - Do not distribute the grease; the pressure of the heatsink will do so for you when you install the heatsink.

10. Inspect the heatsink for dust and lint. Clean the heatsink if necessary.

11. Orient the heatsink so that the screws line up with the mounting studs. Note - The processor heatsink is not symmetrical.

12. Carefully position the heatsink on the processor, aligning it with the mounting posts to reduce movement after it makes initial contact with the layer of thermal grease. Avoid moving the heatsink after it has contacted the top of the processor. Too much movement could disturb the layer of thermal grease, causing voids, and leading to ineffective heat dissipation and component damage.

13. Tighten the Phillips screws with a No. 2 Phillips screwdriver alternately one-half turn until fully seated.

14. Install the air baffle.

15. If the server has a switch card installed, place the switch card cables in the cable troughs in the metal motherboard removal bracket and the air baffle, carefully pull the cables through the chassis mid-wall, and reconnect the cables to the disk backplane.

16. If the server has a DVD drive, place the DVD cable in the cable troughs in the metal motherboard removal bracket and the air baffle, carefully pull the cable through the chassis mid-wall, and reconnect the cable to the disk backplane.

17. Return the Server to operation:

a. Install the server top cover.
b. Close the server fan door.
c. Return the server to the normal rack position.
d. Power on the server.

18. Use Oracle ILOM to clear server processor faults.

a. To show server faults, log in to the server as root using the Oracle ILOM CLI, and type the following command to list all known faults on the system:

-> show /SP/faultmgmt

b. To clear the fault on processor 0, type the following command as an example:

-> set /SYS/MB/P0 clear_fault_action=true

OBTAIN CUSTOMER ACCEPTANCE

WHAT ACTION DOES THE CUSTOMER NEED TO TAKE TO RETURN THE SYSTEM TO AN OPERATIONAL STATE:

Boot up system and verify full functionality

REFERENCE INFORMATION:

Netra Modular System Service Manual Supplement:

http://docs.oracle.com/cd/E59318_01/html/E59323/index.html

References

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