![]() | Oracle System Handbook - ISO 7.0 May 2018 Internal/Partner Edition | ||
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Solution Type Technical Instruction Sure Solution 1587657.1 : Cable Clamp Installation Instructions for Sun Server X3-2L when used in Exadata
Oracle Confidential PARTNER - Available to partners (SUN). Reason: Internal only Applies to:Exadata X3-2 Hardware - Version All Versions and laterExadata X3-8 Hardware - Version All Versions and later Information in this document applies to any platform. GoalCable Clamp Installation Instructions for Sun Server X3-2L when used in Exadata. SolutionNote: This issue described here only applies to X3-2L when used in an Exadata configuration. This issue does not apply to the standalone X3-2L general purpose server.
Issue: The previous cable routing method uses Kapton tape to secure the cable. This is to be replaced by a cable routing method using Cable Clamp (P/N 10075042) contained within FRU 7071084. Parts Needed: Procedure: Note: Following all ESD precautions required when working on an open system.
1. Remove AC cords from X3-2L System. 2. Open X3-2L system and remove Air baffle. 3. Locate LFIM cable on the left side of the system when viewed from front. 4. Detach LFIM cable from socket labelled LFIM on the motherboard. This socket is beside the left most DIMM socket. 5. Remove all Kapton taped used to secure LFIM cable next to motherboard. 6. Open fan door and remove fan module nearest left side wall. 7. The LFIM cable should have some 90degree bends and be held in place by Kapton tape in the space next to the fan module. Loosen tape to free up a length of cable (3 inches). This extra length of cable should be carefully fed through the gap in the midwall being careful not to catch any of the cable insulation on the edge of the midwall. 8.The entire area where the new clips will be installed should be cleaned using the alcohol wipe. From the midwall block, clean the sheet metal back until you reach the motherboard battery. 9. The two clips should now be applied to the sheet metal, located as per the photo below. It is advised to install the second clip first, as it will be easier to measure. 10. The cable should then be routed using the fold locations in the photo below. 11. Any excess cable should be fed back through the midwall, and attached to the side wall with the tape that was loosened in the first step. 12. Plug the cable back into the LFIM socket on the motherboard. 13. Reinstall the Air Baffle and Top Cover and left most fan module 14. Attach AC cords and confirm operation of the Front Indicator Module LED's and T_AMB temperature sensor, both with the system in standby and host power on.
This MOS document was created from the original PDF version by Olly Sharwood that is located in Issue #5 in Doc ID 1501450.1 Additional detail from Exadata Database Machine Hardware Current Product Issues (X3-2, X3-8) (Doc ID 1501450.1) Issue #5: Cell generates CL_TEMP alert for >32C when temperature of Storage Cell or data center is normal (5-32). The alert is a false reading caused by interference between the Front Indicator Module cable and Motherboard components due to mis-routing of the cable within the chassis. False readings anywhere from 30C (in a room of 22C ambient on adjacent units) up to 99C have been observed. The ambient sensor on X3-2L systems is located on the front indicator module near the power button and LED's and should be very close to room ambient under normal readings. Note that ILOM has no threshold for this sensor so will not record a fault or warning message in it directly.
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