Asset ID: |
1-71-1319483.1 |
Update Date: | 2018-04-04 |
Keywords: | |
Solution Type
Technical Instruction Sure
Solution
1319483.1
:
How to Replace a Sun Blade X6275 CPU
Related Items |
- Sun Blade 6000 System
- Sun Blade 6048 System
- Sun Blade X6275 Server Module
|
Related Categories |
- PLA-Support>Sun Systems>Sun_Other>Sun Collections>SN-OTH: x64-CAP VCAP
|
In this Document
Oracle Confidential PARTNER - Available to partners (SUN).
Reason: FRU CAP
Applies to:
Sun Blade 6000 System - Version Not Applicable and later
Sun Blade 6048 System - Version Not Applicable and later
Sun Blade X6275 Server Module - Version Not Applicable and later
Information in this document applies to any platform.
Goal
How to Remove and Replace a Sun Fire X6275 CPU
Solution
DISPATCH INSTRUCTIONS
WHAT SKILLS DOES THE ENGINEER NEED:(IS A SITE ENGINEER AVAILABLE?)
X6275 Trained
TASK COMPLEXITY: 2
Time Estimate: 180 minutes
FIELD ENGINEER INSTRUCTIONS
WHAT STATE SHOULD THE SYSTEM BE IN TO BE READY TO PERFORM THE RESOLUTION ACTIVITY? :
Take ESD Precautions
WHAT ACTION DOES THE ENGINEER NEED TO TAKE:
A. Identifying Faulty Processor:
1. Prepare server module for service.
* Power off server module compute nodes
* Remove server module from Sun Blade chassis
* Attach antistatic wrist strap
* Remove the top cover
2. Press Remind button on motherboard
3. Identify processor and heat sink for replacing.
B. Removing Processor and Heat Sink
1. Identify processor(s)
2. Press down heat sink to counteract pressure of captive screws
3. Loosen each mounting screws that secure heat sink to motherboard(#2 Phillips screwdriver) Turn each one 180 degrees at a time.
4. To separate heat sink from processor, gently wiggle heat sink left and right, while pulling upward
A thin layer of thermal compound separates heat sink and processor
5. After separate heat sink from processor, set heat sink on flat surface, away from server module
* Use an alcohol pad to clean heat sink
* Clean dust from the heat sink fins
* Do not allow thermal compound to contaminate work space or other component
* Apply new thermal compound when you reinstall heat sink
7. Lift processor lever to fully open position
* Holding down processor clamp, carefully release spring lever
* Lift processor clamp up and away processor
8. Lift processor out socket
C. Installing a Processor Heat Sink
1.Ensure processor socket release lever is in open position
2.Align processor over socket
3. Set processor on socket
4. Lower processor clamp, and then latch lever.
5. Ensure the old thermal compound has been removed from component surface and heat sink
6. Using one syringe of thermal compound (500 mg [0.2 ml]), apply compound in an X pattern, stopping short of corners.
7. Position heat sink over processor, and align heat sink screws with screw holes in motherboard
8. Lower heat sink onto processor
9. Press down top of heat sink to counteract pressure of captive spring-loaded screws, use #2 torque screwdriver to alternately tighten each screw 180 degrees at a time, until tight at 8 inch pounds.
10. Repeat Step 1 through Step 9 until all processors are installed.
See Sun Blade X6275 M2 Server Module Service Manual
http://download.oracle.com/docs/cd/E19962-01/821-1084/p66.html#scrolltoc
11. Return server module to operation.
* Install server module top cover.
* Insert server module into Sun Blade chassis.
* Power on server module.
12. Update BIOS and firmware.
* Refer to corresponding ILOM supplement.
OBTAIN CUSTOMER ACCEPTANCE
WHAT ACTION DOES THE CUSTOMER NEED TO TAKE TO RETURN THE SYSTEM TO AN OPERATIONAL STATE:
Verify functionality, no service LEDs or messages
PARTS NOTE:
REFERENCE INFORMATION:
Sun Blade X6275 Server Module Service Manual
http://download.oracle.com/docs/cd/E19464-01/820-6849-13/index.html
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