Sun Microsystems, Inc.  Oracle System Handbook - ISO 7.0 May 2018 Internal/Partner Edition
   Home | Current Systems | Former STK Products | EOL Systems | Components | General Info | Search | Feedback

Asset ID: 1-71-1302417.1
Update Date:2016-01-20
Keywords:

Solution Type  Technical Instruction Sure

Solution  1302417.1 :   How to Replace a Sun Blade X6450 CPU and Heatsink  


Related Items
  • Sun Blade X6450 Server Module
  •  
  • Sun Blade 6000 System
  •  
  • Sun Blade 6048 System
  •  
Related Categories
  • PLA-Support>Sun Systems>Sun_Other>Sun Collections>SN-OTH: x64-CAP VCAP
  •  




In this Document
Goal
Solution


Oracle Confidential INTERNAL - Do not distribute to customer (OracleConfidential).
Reason: FRU CAP

Applies to:

Sun Blade X6450 Server Module - Version Not Applicable and later
Sun Blade 6000 System - Version Not Applicable and later
Sun Blade 6048 System - Version Not Applicable and later
Information in this document applies to any platform.

Goal

How to Replace a CPU and Heatsink Components for the SunBlade X6450

Solution

DISPATCH INSTRUCTIONS

WHAT SKILLS DOES THE ENGINEER NEED:(IS A SITE ENGINEER AVAILABLE?)
Field Engineer

DELIVERY REQUIREMENT:
As required by the customer

TIME ESTIMATE: 120 minutes

FIELD ENGINEER INSTRUCTIONS

WHAT STATE SHOULD THE SYSTEM BE IN TO BE READY TO PERFORM THE RESOLUTION ACTIVITY? :

Do not operate the system with empty slots. Always insert a filler into an empty slot to reduce the possibility of module shutdown.

WHAT ACTION DOES THE ENGINEER NEED TO TAKE:

1. Power off the server and remove the server module from the chassis

2. Remove the main cover

3. Press the Remind button on the motherboard to blink the LED for the CPU that has failed

4. Identify which CPU and heatsink you are replacing.(notes: If LED is off the CPU is operating properly, and if LED is lit (amber) the CPU has failed, and should be replaced)

To remove the Heatsink:

a. Gently press down on the top of the heatsink to counteract the pressure of the captive spring-loaded screws that secure the heatsink to the motherboard.

b. Alternately loosen each of the four spring-loaded mounting screws that secure the heatsink to the motherboard.  Turn the screws 180 degrees at a time, then remove the screws when they are detached.

c. Separate the heatsink from the top of the CPU, gently wiggle the heatsink left and right, while pulling upward, note that the parts have a thin layer of thermal compound, beware not to contaminate the other parts of the motherboard.

To remove the CPU:

a. Lift the CPU socket lever to the fully open position.

b. Lift the CPU out of the socket, leaving the lever in the open position.

To reinstall the parts:

CPU:

a. Ensure that the CPU socket release lever is in the fully open position.

b. Align the CPU over the CPU socket.

c. Gently set the CPU on the socket.

d. When the CPU is fully seated in the socket secure the CPU in the socket by lowering the release lever and putting in the locked position.

Heatsink:

a. Using one syringe of thermal compound (500 mg [0.2 ml]), carefully apply the compound to the top of the CPU in an X, if you are reinstalling an existing heatsink, use an alcohol pad to clean all the old thermal compound from the bottom surface of the heatsink.

b. Carefully position heatsink over the CPU, and align the heatsink screws with the screw holes in the motherboard and use a torque driver to alternately tighten each of the 4 mounting screws, 180 degrees at a time, until each spring is completely compressed.  Tighten screws to 8 in-lbs (0.8 Nm).

When all the parts are installed update the BIOS and firmware.

OBTAIN CUSTOMER ACCEPTANCE

WHAT ACTION DOES THE CUSTOMER NEED TO TAKE TO RETURN THE SYSTEM TO AN OPERATIONAL STATE:

Restart the system.

PARTS NOTE:
No parts and location

REFERENCE INFORMATION:
http://download.oracle.com/docs/cd/E19045-01/blade.x6450/index.html


Attachments
This solution has no attachment
  Copyright © 2018 Oracle, Inc.  All rights reserved.
 Feedback