|
Processor |
| Number |
One or Two SPARC S7 8-Core, 4.27GHz processors, not expandable |
| CPUs |
- Up to 64 threads per processor (up to 8 threads per core)
- Four data analytics accelerators per processor, each supporting four
concurrent in-memory query operations with decompression
- Eight on-chip encrytion instruction accelerators with direct nonpriviledged
support for 15 industry-standard cryptographic algorithms: AES, Camellia,
CRC32c, DES, 3DES, DH, DSA, ECC, MD5, RSA, SHA-1, SHA-224, SHA-256,
SHA-384, SHA-512 (one per core)
- Eight floating-point units per processor (one per core)
- One random number generator (one per processor)
|
| Cache memory |
Level 1: 16KB instruction and 16 KB data per core
Level 2: 256 KB L2 I$ per four cores, 256 KB L2 D$ per core pair
Level 3: 16 MB L3$ on chip |
|
Main Memory |
| Capacities |
- DIMM slots: 8 slots per processor, supporting half or fully
populated configurations
- DIMM type: DDR4-2400
- DIMM size: 16GB, 32GB, or 64GB
- Maximum capacity: 1024GB max configuration with 64GB DIMMs
and two processors
|
|
Standard Integrated Interfaces
|
| Network |
4 × 10 GbE Ethernet ports (100 Mbps/1 Gbps/10 Gbps),
full duplex only, auto-negotiating |
| Network Management |
One dedicated 10Mbps/100Mbps/1Gbps RJ-45 port Ethernet port |
| Serial Management |
One dedicated RJ-45 port |
| Remote Management |
Onboard service processor, running Integrated Lights Out Manager
(ILOM) |
| USB |
Two front USB 2.0 ports, 1 rear USB 3.0 port |
| PCI Expansion Slots |
- 6 low-profile PCI-Express 3.0 x8 slots.
| Slot # |
Physical |
Electrical |
| 1 |
x16 |
x8 |
| 2 |
x8 |
x8 |
| 3 |
x8 |
x8 |
| 4 |
x8 |
x8 |
| 5 |
x16 |
x8 |
| 6 |
x8 |
x8 |
|
|
Internal Mass Storage |
| Disks |
- 1x 12Gbps SAS-3 controller
- Eight disk chassis - 8x 2.5-inch SAS-3 disk drive slots
- 600GB or 1.2TB 2.5-inch SAS-3 disk drives
- 400GB or 800GB 2.5-inch SAS-3 solid state drives
- 3.2TB 2.5-inch NVMe solid state drives
|
|
Power Supplies |
| 2× 800W/1200W, hot-swappable, 1+1 redundant power supply
units (PSU) AC and DC |
|
Environment |
| Input Voltage |
AC:
100 to 127 VAC, 50/60 Hz range. 800W max
200 to 240 VAC, 50/60 Hz range. 1200W max
DC:
-48 to -60 VDC, 1200W max
-40 to -47 VDC, 900W max
|
| Input Current |
AC:
10A (100 to 127 VAC)
7A (200 to 240 VAC)
DC:
36A max @ -48 VDC bus
28A max @ -60 VDC bus |
| Input Power |
AC: 851/819 W @ 100/200 VAC (max)
DC: 850 W @ -48/-60 VDC (max) |
| Power Consumption |
 Online
power calculator |
| Temperature |
Operating: 5° C to 45° C (41° F to 113° F) up
to 1829 meters (6000 ft); Maximum ambient operating temperature is derated
by 1° C per 500 m elevation.
Nonoperating: -40° C to 70° C (-40° F to 158° F)
Optimal: 21° C to 23° C (69.8° F to 73.4° F)
Short Term Maximum: -5° C to 55° C (23° F to 131°
F)
|
| Humidity |
Operating: 5% to 85% noncondensing, not to exceed 0.024
kg water/kg dry air (0.053 lb water/2.205 lbs. dry air)
Nonoperating: 93% noncondensing, 40° C (104° F) maximum wet
bulb
Short term: 5% to 90% relative humidity, noncondensing, not to exceed
0.024 kg of water per kg of dry air (0.053 lb water/2.205 lbs. dry air) |
| Altitude (company requirement) |
Operating: Maximum 3000 m (9840 ft) at 40° C (104°
F)
Nonoperating: Maximum 12000 m (39370 ft) |
| Altitude (NEBS requirement) |
Operating: -60 m to 1800 m (-200 ft. to 5905 ft) at 40° C
(104° F)
1800 m to 4000 m (5905 ft to 13123 ft) at 30° C (86° F)
Nonoperating: Up to 12,000m (39,370 ft.)
|
| Acoustic Noise |
Operating: 75 dBA (AC Server) |
Regulations
Meets or exceeds the following requirements: |
| Safety |
UL/CSA 60950-1, EN 60950-1, IEC 60950-1 2006, IEC60950-1 CB
Scheme with all country differences |
| ETSI |
EN 300019-2-1, 2, 3 Class 1.2, 2.3, 3.1E (except condensing
humidity and rain) |
| NEBS |
NEBS level 3 certified by Telcordia |
| Seismic |
GR-63-CORE requirements for earthquake Zone 4 |
| Emissions |
FCC CFR 47 Part 15, ICES-003, EN55024, EN61000-3-2 and EN61000-3-3,
EN300-385 |
| Immunity |
EN55024 |
| Certifications |
North American Safety (NRTL), European Union (EU), International
CB Scheme, BIS (India), BSMI (Taiwan), RCM (Australia), CCC (PRC), MSIP
(Korea), VCCI (Japan), EAC (Russia) |
| European Union Directives |
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU,
Low Voltage Directive 2014/35/EU, EMC Directive 2014/30/EU, and WEEE Directive
2012/19/EU |
|
Dimensions and Weight |
| Height |
88 mm (3.5 in.), 2U |
| Width |
Chassis: 425 mm (16.73 in.)
Max width from bezel front to rear protrusions: 445 mm (17.52 in) |
| Depth |
Chassis: 608 mm (23.9 in.)
Max depth from bezel front to rear protrusions: 640 mm (25.2 in)
|
| Weight |
Fully configured without PCIe cards: 21.5 kg (47.3 lbs)
(may vary based on internal options)
|
| Clearance
and Service Access |
| Front |
914.4 mm (36 in.) |
| Rear |
914.4 mm (36 in.) |
