Sun Microsystems, Inc.   Oracle System Handbook - ISO 7.0 May 2018 Internal/Partner Edition
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511-1213 541-4081 7049264 7049265
System Board Assembly/FRU
511-1213 + Tray
Tray 541-2543
System Board Assembly/FRU
7049264 + Tray
Tray 541-2543

Headers, Jumpers, LEDs, and Switches

LOCATION PINS SETTING DESCRIPTION
J602 1-2 Out Clear SP Password (install to clear)
J603 1-2 Out SP Debug
J702 1-2 Out SP Disable
J705 1-2 NA Not Stuffed
J706 1-2 NA Not Stuffed
J2403 1-2 In BIOS Write Enable (default)
J2601 1-2 Out Manfacturing Mode (default)
J3302 1-2 Out CPLD Debug
J3402 1-3 Out Unknown
J3403 1-3 Out Unknown
J3404 1-3 Out Unknown

Notes

  1. The minimum Solaris operating system is Solaris 10 10/09.
  2. The System Board FRU includes two 250-1802 Cleaning Wipes, and
    two 310-0065 Shin-Etsu X23-7783D Thermal Grease Syringes.
  3. SW 1.3 is required to support Intel E5649, X5675, and X5690 processors.

Heatsink Notes

  1. Use a 5/32" hex driver to remove and replace the heatsink screws.
  2. Heatsink FRU 541-2545 includes Heatsink 310-0161, two 240-6751 SpringScrews,
    one 250-1802 Cleaning Wipe and one 310-0065 Shin-Etsu X23-7783D Thermal
    Grease Syringe. Heatsink 310-0161 is pre-greased with Shin-Etsu G751.
  3. Heatsink FRU 541-3310 includes Heatsink 310-0211, two 240-6751 SpringScrews,
    one 250-1802 Cleaning Wipe and one 310-0065 Shin-Etsu X23-7783D Thermal
    Grease Syringe. Heatsink 310-0211 is pre-greased with Shin-Etsu G751.

Memory Installation Notes

  1. Install memory filler panel 350-1288 in all unused slots.
  2. Install the first three DIMMs in CPU0 and CPU1 slots D8, D5, and D2.
  3. Install the second three DIMMs in CPU0 and CPU1 slots D7, D4, and D1.
  4. Use of the same DIMM size and speed is recommended for maximum performance.

References

  1. Sun Fire X4170 M2 Server Documentation.
  2. Sun Fire X4270 M2 Server Documentation.

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